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Microstrip Isolator

Microstrip isolators are a commonly used RF and microwave device used for signal transmission and isolation in circuits. It uses thin film technology to create a circuit on top of a rotating magnetic ferrite, and then adds a magnetic field to achieve it. The installation of microstrip isolators generally adopts the method of manual soldering of copper strips or gold wire bonding. The structure of microstrip isolators is very simple, compared to coaxial and embedded isolators. The most obvious difference is that there is no cavity, and the conductor of the microstrip isolator is made by using a thin film process (vacuum sputtering) to create the designed pattern on the rotary ferrite. After electroplating, the produced conductor is attached to the rotary ferrite substrate. Attach a layer of insulating medium on top of the graph, and fix a magnetic field on the medium. With such a simple structure, a microstrip isolator has been fabricated.


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Product Tags

Data Sheet

 RFTYT 2.0-30GHz Microstrip Isolator 
 Model   Frequency range
(
GHz) 
Insert loss (dB)
(Max)
Isolation (dB)
(Min)
VSWR
(Max)
Operation temperature
(
℃)
Peak power
(W)
 Reverse Power
(
W)
Dimension
W×L×Hmm
Specification
MG1517-10 2.0~6.0 1.5 10 1.8 -55~85 50 2 15.0*17.0*4.0 PDF
MG1315-10 2.7~6.2 1.2 1.3 1.6 -55~85 50 2 13.0*15.0*4.0 PDF
MG1214-10 2.7~8.0 0.8 14 1.5 -55~85 50 2 12.0*14.0*3.5 PDF
MG0911-10 5.0~7.0 0.4 20 1.2 -55~85 50 2 9.0*11.0*3.5 PDF
MG0709-10 5.0~13 1.2 11 1.7 -55~85 50 2 7.0*9.0*3.5 PDF
MG0675-07 7.0~13.0 0.8 15 1.45 -55~85 20 1 6.0*7.5*3.0 PDF
MG0607-07 8.0-8.40 0.5 20 1.25 -55~85 5 2 6.0*7.0*3.5 PDF
MG0675-10 8.0-12.0 0.6 16 1.35 -55~+85 5 2 6.0*7.0*3.6 PDF
MG6585-10 8.0~12.0 0.6 16 1.4 -40~+50 50 20 6.5*8.5*3.5 PDF
MG0719-15 9.0~10.5 0.6 18 1.3 -30~+70 10 5 7.0*19.5*5.5 PDF
MG0505-07 10.7~12.7 0.6 18 1.3 -40~+70 10 1 5.0*5.0*3.1 PDF
MG0675-09 10.7~12.7 0.5 18 1.3 -40~+70 10 10 6.0*7.5*3.0 PDF
MG0506-07 11~19.5 0.5 20 1.25 -55~85 20 1 5.0*6.0*3.0 PDF
MG0507-07 12.7~14.7 0.6 19 1.3 -40~+70 4 1 5.0*7.0*3.0 PDF
MG0505-07 13.75~14.5 0.6 18 1.3 -40~+70 10 1 5.0*5.0*3.1 PDF
MG0607-07 14.5~17.5 0.7 15 1.45 -55~+85 5 2 6.0*7.0*3.5 PDF
MG0607-07 15.0-17.0 0.7 15 1.45 -55~+85 5 2 6.0*7.0*3.5 PDF
MG0506-08 17.0-22.0 0.6 16 1.3 -55~+85 5 2 5.0*6.0*3.5 PDF
MG0505-08 17.7~23.55 0.9 15 1.5 -40~+70 2 1 5.0*5.0*3.5 PDF
MG0506-07 18.0~26.0 0.6 1 1.4 -55~+85 4   5.0*6.0*3.2 PDF
MG0445-07 18.5~25.0 0.6 18 1.35 -55~85 10 1 4.0*4.5*3.0 PDF
MG3504-07 24.0~41.5 1 15 1.45 -55~85 10 1 3.5*4.0*3.0 PDF
MG0505-08 25.0~31.0 1.2 15 1.45 -40~+70 2 1 5.0*5.0*3.5 PDF
MG3505-06 26.0~40.0 1.2 11 1.6 -55~+55 4   3.5*5.0*3.2 PDF
MG0505-62 27.0~-31.0 0.7 17 1.4 -40~+75 1 0.5 5.0*11.0*5.0 PDF
MG0511-10 27.0~31.0 1 18 1.4 -55~+85 1 0.5 5.0*5.0*3.5 PDF
MG0505-06 28.5~30.0 0.6 17 1.35 -40~+75 1 0.5 5.0*5.0*4.0 PDF

Overview

The advantages of microstrip isolators include small size, light weight, small spatial discontinuity when integrated with microstrip circuits, and high connection reliability. Its relative disadvantages are low power capacity and poor resistance to electromagnetic interference.

Principles for selecting microstrip isolators:
1. When decoupling and matching between circuits, microstrip isolators can be selected.

2. Select the corresponding product model of the microstrip isolator based on the frequency range, installation size, and transmission direction used.

3. When the operating frequencies of both sizes of microstrip isolators can meet the usage requirements, products with larger volumes generally have higher power capacity.

Circuit connections for microstrip isolators:
The connection can be made using manual soldering with copper strips or gold wire bonding.

1. When purchasing copper strips for manual welding interconnection, the copper strips should be made into an Ω shape, and the solder should not soak into the forming area of the copper strip. Before welding, the surface temperature of the isolator should be maintained between 60 and 100 ° C.

2. When using gold wire bonding interconnection, the width of the gold strip should be smaller than the width of the microstrip circuit, and composite bonding is not allowed.


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